49 specification typical test method moisture resistance, thermal shock load life load life in moisture resistance to soldering heat solderability terminal strength dielectric withstanding voltage short time overload insulation resistance ?0.25%+0.05 ? ) ?0.5%+0.05 ? ) ?0.5%+0.05 ? ) ?0.25%+0.05 ? ) min. 95% coverage ?0.2%+0.05 ? ) ?0.25%+0.05 ? ) ?0.25%+0.05 ? ) 1,000 meg minimum 0.1% 0.2% 0.25% 0.05% 95% 0.05% 0.05% 0.05% 1,000 meg jis c 5202 7.4 jis c 5202 7.10 jis c 5202 7.9 jis c 5202 6.4, 260??, 10 sec. jis c 5202 6.5 eiaj rc-2609a 6.6 eiaj rc-2609a 6.5 test voltage: 10@ 150vac, rn12 @ 300vac jis c 5202 7.4 eiaj rc-2609a 6.36 cal-chip e l e c t r o n i c s , i n c o r p o r a t e d thin film chip resistors or dering inf ormation example: 0805 1/10 watt .1% 1k 10 b 1001 ct wattage rn thin film packaging (tape & reel) tolerance *note b = .1% c = .25% d = .50% resistance f ea tures ? surface mount devices (smd) ? precision tolerances of 0.5% to 0.1% ? temperature coefficients of 50ppm/c and 25ppmc ? precision performance ? space saving construction rn10 rn12 0805 1206 1/8 @ 70? 1/8@ 70? 150v 150v 300v 300v ?0ppm/? ?5ppm/? ?0ppm/? ?5ppm/? 10ohm - 787k 100ohm - 100k 10ohm - 787k 49.9ohm - 1m d = ?.5% c=?.25%, b=?.1% d = ?.5% c=?.25%, b=?.1% dimensions in mm material alumina porcelain nickel-chromium film boro-silicated acid lead glass 100% matte tin (elect r ical plated) o v er nickel (electrical plated) over ag-pd (silver-palladium [glaze printed]) remarks (reference only) purity 96% min. 20 microns thick 20 microns thick 3/5 microns thi c k 3/8 microns thi c k 8 microns thick feature substrate resistive film coating terminations rn10 .078?008 (2.00?.20) .049?008 (1.25?.20) .018?004 (0.45?.10) .016?008 (0.40?.20) .012?008/-.004 (0.30+0.20/-0.10) rn12 .122?004 (3.10?.10) .061?004 (1.55?.10) .021+.004/-.002 (0.55+0.10/-0.05) .018?008 (0.45?.20) .012+.008/-.004 (0.30+0.20/-0.10) feature l - body length w - body width h - body height a - top termination b - bottom termination notes: 1. embossed taping available on rn12 only. e nvir onment al m a terials p erformance c hara cteristics rn s eries glass coat resistive film substrate terminations (tested per mil-std-202) electrical (operating temperature range -55c to +155c) dimensions in mm type packaging size power rating ( watts) max.working voltage max. overload voltage resistance temp. coefficient resistance range tolerance 1
49 specification typical test method moisture resistance, thermal shock load life load life in moisture resistance to soldering heat solderability terminal strength dielectric withstanding voltage short time overload insulation resistance (0.25%+0.05 ) (0.5%+0.05 ) (0.5%+0.05 ) (0.25%+0.05 ) min. 95% coverage (0.2%+0.05 ) (0.25%+0.05 ) (0.25%+0.05 ) 1,000 meg minimum 0.1% 0.2% 0.25% 0.05% 95% 0.05% 0.05% 0.05% 1,000 meg jis c 5202 7.4 jis c 5202 7.10 jis c 5202 7.9 jis c 5202 6.4, 2605?c, 10 sec. jis c 5202 6.5 eiaj rc-2609a 6.6 eiaj rc-2609a 6.5 test voltage: 10@ 150vac, rn12 @ 300vac jis c 5202 7.4 eiaj rc-2609a 6.36 cal-chip e l e c t r o n i c s , i n c o r p o r a t e d thin film chip resistors or dering inf ormation example: 0805 1/10 watt .1% 1k 10 b 1001 ct wattage rn thin film packaging (tape & reel) tolerance *note b = .1% c = .25% d = .50% resistance f ea tures ? surface mount devices (smd) ? precision tolerances of 0.5% to 0.1% ? temperature coefficients of 50ppm/c and 25ppmc ? precision performance ? space saving construction type rn04 rn06 packaging size 0402 0603 power rating (watts) 1/16 @ 70?c 1/10 @ 70?c max. working voltage 50v 75v max. overload voltage 100v 150v resistance temp. coefficient 50ppm/?c 25ppm/?c 50ppm/?c 25ppm/?c resistance range 10 - 97.6k 100 - 100k 10 - 97.6k 49.9 - 360k tolerance 1 d = 0.5% c=0.25%, b=0.1% d = 0.5% c=0.25%, b=0.1% dimensions in mm dimensions in mm material alumina porcelain nickel-chromium film boro-silicated acid lead glass 100% matte tin (electrical plated) over nickel (electrical plated) over ag-pd (silver-palladium [glaze printed]) remarks (reference only) purity 96% min. 20 microns thick 20 microns thick 3/8 microns thick 3/5 microns thick 8 microns thick feature substrate resistive film coating terminations rn04 1.000.05 0.500.05 0.350.05 0.200.10 0.200.10 rn06 1.600.20 0.800.20 0.300.20 0.30+-0.20 feature l - body length w - body width h - body height a - top termination b - bottom termination notes: 1. embossed taping available on rn12 only. e nvir onment al m a terials p erformance c hara cteristics (tested per mil-std-202) electrical (operating temperature range -55c to +155c) rn s eries glass coat resistive film substrate terminations 0.40+-0.10
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